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"Effects of process conditions on reliability, microstructure evolution and ..."

Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi (2006)

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DOI: 10.1016/J.MICROREL.2005.05.005

access: closed

type: Journal Article

metadata version: 2020-02-22

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Periannan Arulvanan, Zhaowei Zhong, Xunqing Shi:
Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints. Microelectron. Reliab. 46(2-4): 432-439 (2006)

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