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"Through Silicon Via (TSV) defect investigations using lateral emission ..."

C. Cassidy et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.07.116

access: closed

type: Journal Article

metadata version: 2020-02-22

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C. Cassidy, J. Teva, Jochen Kraft, Franz Schrank:
Through Silicon Via (TSV) defect investigations using lateral emission microscopy. Microelectron. Reliab. 50(9-11): 1413-1416 (2010)

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