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"Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint ..."
Hongtao Chen, C. Q. Wang, M. Y. Li (2006)
- Hongtao Chen, C. Q. Wang, M. Y. Li:
Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling. Microelectron. Reliab. 46(8): 1348-1356 (2006)
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