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"Reliability of interfacial adhesion in a multi-level copper/low-k ..."

C. C. Chiu et al. (2007)

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DOI: 10.1016/J.MICROREL.2007.07.019

access: closed

type: Journal Article

metadata version: 2022-11-23

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C. C. Chiu, H. H. Chang, C. C. Lee, C. C. Hsia, Kuo-Ning Chiang:
Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure. Microelectron. Reliab. 47(9-11): 1506-1511 (2007)

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