![](https://dblp.org/img/logo.ua.320x120.png)
![](https://dblp.org/img/dropdown.dark.16x16.png)
![](https://dblp.org/img/peace.dark.16x16.png)
Остановите войну!
for scientists:
![search dblp search dblp](https://dblp.org/img/search.dark.16x16.png)
![search dblp](https://dblp.org/img/search.dark.16x16.png)
default search action
"Warpage evolution of overmolded ball grid array package during post-mold ..."
Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai (2011)
- Tz-Cheng Chiu, Hong-Wei Huang, Yi-Shao Lai:
Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. Microelectron. Reliab. 51(12): 2263-2273 (2011)
![](https://dblp.org/img/cog.dark.24x24.png)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.