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"Interfacial reliability between hot-melt polyamides resin and textile for ..."

Soon-Wan Chung, Hyun-Tae Kim (2012)

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DOI: 10.1016/J.MICROREL.2012.02.014

access: closed

type: Journal Article

metadata version: 2020-02-22

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Soon-Wan Chung, Hyun-Tae Kim:
Interfacial reliability between hot-melt polyamides resin and textile for wearable electronics application. Microelectron. Reliab. 52(7): 1501-1510 (2012)

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