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"Finite element modeling on electromigration of solder joints in wafer ..."

Pridhvi Dandu et al. (2010)

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DOI: 10.1016/J.MICROREL.2009.12.003

access: closed

type: Journal Article

metadata version: 2022-06-23

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Pridhvi Dandu, Xuejun Fan, Y. Liu, C. Diao:
Finite element modeling on electromigration of solder joints in wafer level packages. Microelectron. Reliab. 50(4): 547-555 (2010)

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