"Highly variable Sn-Cu diffusion soldering process for high performance ..."

D. Feil et al. (2017)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2017.07.058

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/FeilHGN17
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/FeilHGN17
D. Feil, T. Herberholz, M. Guyenot, Mathias Nowottnick:
Highly variable Sn-Cu diffusion soldering process for high performance power electronics. Microelectron. Reliab. 76-77: 455-459 (2017)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.