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"Development and characterisation of pressed packaging solutions for ..."

Jose Angel Ortiz Gonzalez et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.07.062

access: closed

type: Journal Article

metadata version: 2021-10-14

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Jose Angel Ortiz Gonzalez, Attahir Murtala Aliyu, Olayiwola Alatise, Alberto Castellazzi, Li Ran, Phil Mawby:
Development and characterisation of pressed packaging solutions for high-temperature high-reliability SiC power modules. Microelectron. Reliab. 64: 434-439 (2016)

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