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"Creep lifetime prediction of solder joint for heat sink assembly."
Changwoon Han et al. (2010)
- Changwoon Han, Chulmin Oh, Nochang Park, Wonsik Hong:
Creep lifetime prediction of solder joint for heat sink assembly. Microelectron. Reliab. 50(9-11): 1645-1649 (2010)
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