"An advanced quality and reliability assessment approach applied to thermal ..."

Michael Hertl, Diane Weidmann, Jean-Claude Lecomte (2009)

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DOI: 10.1016/J.MICROREL.2009.07.045

access: closed

type: Journal Article

metadata version: 2020-02-22

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Michael Hertl, Diane Weidmann, Jean-Claude Lecomte:
An advanced quality and reliability assessment approach applied to thermal stress issues in electronic components and assemblies. Microelectron. Reliab. 49(9-11): 1148-1152 (2009)

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