"Improving the FE simulation of molded packages using warpage measurements."

Saskia Huber et al. (2014)

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DOI: 10.1016/J.MICROREL.2014.07.156

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type: Journal Article

metadata version: 2022-10-02

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Saskia Huber, Marius van Dijk, Hans Walter, Olaf Wittler, Tina Thomas, Klaus-Dieter Lang:
Improving the FE simulation of molded packages using warpage measurements. Microelectron. Reliab. 54(9-10): 1862-1866 (2014)

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