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"Effects of bonding temperature on the properties and reliabilities of ..."

J. S. Hwang, M. J. Yim, K. W. Paik (2008)

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DOI: 10.1016/J.MICROREL.2006.07.097

access: closed

type: Journal Article

metadata version: 2020-02-22

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J. S. Hwang, M. J. Yim, K. W. Paik:
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application. Microelectron. Reliab. 48(2): 293-299 (2008)

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