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"The performance and fracture mechanism of solder joints under mechanical ..."

Wei-Luen Jang et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.03.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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Wei-Luen Jang, Tai-Siang Wang, Yen-Fen Lai, Kwang-Lung Lin, Yi-Shao Lai:
The performance and fracture mechanism of solder joints under mechanical reliability test. Microelectron. Reliab. 52(7): 1428-1434 (2012)

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