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"Ball impact responses of Sn-1Ag-0.5Cu solder joints at different ..."

Chin-Li Kao, Tei-Chen Chen (2018)

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DOI: 10.1016/J.MICROREL.2018.02.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Chin-Li Kao, Tei-Chen Chen:
Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes. Microelectron. Reliab. 82: 204-212 (2018)

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