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"Effects of fourth alloying additive on microstructures and tensile ..."

K. S. Kim, S. H. Huh, K. Suganuma (2003)

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DOI: 10.1016/S0026-2714(02)00239-1

access: closed

type: Journal Article

metadata version: 2020-02-22

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K. S. Kim, S. H. Huh, K. Suganuma:
Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu. Microelectron. Reliab. 43(2): 259-267 (2003)

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