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"Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding."

Ryuichi Kondou et al. (2012)

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DOI: 10.1016/J.MICROREL.2010.12.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/KondouWSS12
Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga:
Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding. Microelectron. Reliab. 52(2): 342-346 (2012)

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