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"Effect of bump size on current density and temperature distributions in ..."

Wei-Chih Kuan, S. W. Liang, Chih Chen (2009)

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DOI: 10.1016/J.MICROREL.2009.03.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Wei-Chih Kuan, S. W. Liang, Chih Chen:
Effect of bump size on current density and temperature distributions in flip-chip solder joints. Microelectron. Reliab. 49(5): 544-550 (2009)

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