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"A theoretical study to improve wire sag of ultra-long wire bond loops for ..."
Huang-Kuang Kung, Chi-Lung Hsieh (2017)
- Huang-Kuang Kung, Chi-Lung Hsieh:
A theoretical study to improve wire sag of ultra-long wire bond loops for 3D/MCM packaging. Microelectron. Reliab. 78: 272-279 (2017)
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