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"Experimental studies of board-level reliability of chip-scale packages ..."
Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh (2006)
- Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh:
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectron. Reliab. 46(2-4): 645-650 (2006)
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