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"Major factors to the solder joint strength of ENIG layer in FC BGA package."

Dong-Jun Lee, Hyo S. Lee (2006)

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DOI: 10.1016/J.MICROREL.2005.08.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Dong-Jun Lee, Hyo S. Lee:
Major factors to the solder joint strength of ENIG layer in FC BGA package. Microelectron. Reliab. 46(7): 1119-1127 (2006)

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