Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John ..."

Johan Liu (2003)

> Home

Details and statistics

DOI: 10.1016/S0026-2714(03)00033-7

access: closed

type: Journal Article

metadata version: 2020-02-22

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/Liu03
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/Liu03
Johan Liu:
Foldable Flex and Thinned Silicon Chips for Multichip Packaging; John Balde (Ed.), Kluwer Academic Publishers, Boston, USA, December 2002. Hardbound, 340 pp, Number of figures and tables 200, ISBN 0-7923-7676-5. Microelectron. Reliab. 43(4): 681-683 (2003)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.