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"Dynamic responses and solder joint reliability under board level drop test."

Jing-en Luan et al. (2007)

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DOI: 10.1016/J.MICROREL.2006.05.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/LuanTPLZ07
Jing-en Luan, Tong Yan Tee, Eric Pek, Chwee Teck Lim, Zhaowei Zhong:
Dynamic responses and solder joint reliability under board level drop test. Microelectron. Reliab. 47(2-3): 450-460 (2007)

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