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"Prediction of pad cratering fracture at the copper pad - Printed circuit ..."

Siva P. V. Nadimpalli, Jan K. Spelt (2012)

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DOI: 10.1016/J.MICROREL.2012.02.015

access: closed

type: Journal Article

metadata version: 2020-02-22

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Siva P. V. Nadimpalli, Jan K. Spelt:
Prediction of pad cratering fracture at the copper pad - Printed circuit board interface. Microelectron. Reliab. 52(7): 1454-1463 (2012)

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