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"Experimental characterization and mechanical behavior analysis of ..."
Chih-Tang Peng et al. (2006)
- Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang
, Terry Ku, Kenny Chang:
Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectron. Reliab. 46(2-4): 523-534 (2006)
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