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"Impact of underfill and other physical dimensions on Silicon Lateral IGBT ..."

Pushparajah Rajaguru et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.02.024

access: closed

type: Journal Article

metadata version: 2023-10-16

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Pushparajah Rajaguru, H. Lu, Chris Bailey, Alberto Castellazzi, V. Pathirana, N. Udugampola, Florin Udrea:
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables. Microelectron. Reliab. 83: 146-156 (2018)

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