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"Evaluation of wire bonding performance, process conditions, and ..."
Daniel T. Rooney et al. (2005)
- Daniel T. Rooney, DeePak Nager, David Geiger, Dongkai Shanguan:
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds. Microelectron. Reliab. 45(2): 379-390 (2005)
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