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"Novel wire bond material for advanced power module packages."

Ralf Schmidt, Christian König, P. Prenosil (2012)

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DOI: 10.1016/J.MICROREL.2012.06.139

access: closed

type: Journal Article

metadata version: 2022-02-04

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Ralf Schmidt, Christian König, P. Prenosil:
Novel wire bond material for advanced power module packages. Microelectron. Reliab. 52(9-10): 2283-2288 (2012)

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