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"Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: ..."

Fei Su et al. (2011)

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DOI: 10.1016/J.MICROREL.2011.01.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Fei Su, Ronghai Mao, Xiaoyan Wang, Guangzhou Wang, Haiyan Pan:
Creep behaviour of Sn-3.8Ag-0.7Cu under the effect of electromigration: Experiments and modelling. Microelectron. Reliab. 51(5): 1020-1024 (2011)

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