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"Selective bonding and encapsulation for wafer-level vacuum packaging of ..."

Yi Tao, Ajay P. Malshe, William D. Brown (2004)

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DOI: 10.1016/S0026-2714(03)00192-6

access: closed

type: Journal Article

metadata version: 2020-02-22

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Yi Tao, Ajay P. Malshe, William D. Brown:
Selective bonding and encapsulation for wafer-level vacuum packaging of MEMS and related micro systems. Microelectron. Reliab. 44(2): 251-258 (2004)

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