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"Modular sensor chip design for package stress evaluation and reliability ..."
A. D. Trigg et al. (2012)
- A. D. Trigg, Tai Chong Chai, Xiaowu Zhang
, Xian Tong Chen, Leong Ching Wai:
Modular sensor chip design for package stress evaluation and reliability characterisation. Microelectron. Reliab. 52(8): 1581-1585 (2012)
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