"Mechanical design and analysis of direct-plated-copper aluminum nitride ..."

Ming-Yi Tsai et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.08.010

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type: Journal Article

metadata version: 2024-04-20

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Ming-Yi Tsai, P. S. Huang, C. H. Lin, C. T. Wu, S. C. Hu:
Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability. Microelectron. Reliab. 55(12): 2589-2595 (2015)

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