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"Bond reliability under humid environment for coated copper wire and bare ..."

Tomohiro Uno (2011)

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DOI: 10.1016/J.MICROREL.2010.03.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tomohiro Uno:
Bond reliability under humid environment for coated copper wire and bare copper wire. Microelectron. Reliab. 51(1): 148-156 (2011)

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