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"Thermal performance impacts of heat spreading lids on flip chip packages: ..."

Jamil A. Wakil (2006)

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DOI: 10.1016/J.MICROREL.2005.01.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jamil A. Wakil:
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks. Microelectron. Reliab. 46(2-4): 380-385 (2006)

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