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"A testing method for assessing solder joint reliability of FCBGA packages."

Jinlin Wang et al. (2004)

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DOI: 10.1016/J.MICROREL.2003.10.009

access: closed

type: Journal Article

metadata version: 2020-02-22

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Jinlin Wang, H. K. Lim, H. S. Lew, Woon Theng Saw, Chew Hong Tan:
A testing method for assessing solder joint reliability of FCBGA packages. Microelectron. Reliab. 44(5): 833-840 (2004)

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