"Assembly yield prediction of plastically encapsulated packages with a ..."

Hsiu-Ping Wei et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.09.006

access: closed

type: Journal Article

metadata version: 2020-02-22

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Hsiu-Ping Wei, Bongtae Han, Byeng Dong Youn, Hyuk Shin, Ilho Kim, Hojeong Moon:
Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method. Microelectron. Reliab. 78: 319-330 (2017)

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