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"Advances in the drop-impact reliability of solder joints for mobile ..."

Ee-Hua Wong et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.12.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai:
Advances in the drop-impact reliability of solder joints for mobile applications. Microelectron. Reliab. 49(2): 139-149 (2009)

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