"A study in flip-chip UBM/bump reliability with effects of SnPb solder ..."

J. D. Wu et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.01.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J. J. Lee:
A study in flip-chip UBM/bump reliability with effects of SnPb solder composition. Microelectron. Reliab. 46(1): 41-52 (2006)

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