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"Modeling of board-level package by Finite Element Analysis and laser ..."

Bo Zhang et al. (2010)

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DOI: 10.1016/J.MICROREL.2010.03.009

access: closed

type: Journal Article

metadata version: 2022-11-02

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Bo Zhang, Pinkuan Liu, Han Ding, Wenwu Cao:
Modeling of board-level package by Finite Element Analysis and laser interferometer measurements. Microelectron. Reliab. 50(7): 1021-1027 (2010)

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