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"Effect of solder creep on the reliability of large area die attachment."
W. D. Zhuang et al. (2001)
- W. D. Zhuang, P. C. Chang, F. Y. Chou, R. K. Shiue:
Effect of solder creep on the reliability of large area die attachment. Microelectron. Reliab. 41(12): 2011-2021 (2001)
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