"Investigation of Potting-Adhesive-Induced Thermal Stress in MEMS Pressure ..."

Yunfan Zhang et al. (2021)

Details and statistics

DOI: 10.3390/S21062011

access: open

type: Journal Article

metadata version: 2021-05-26

a service of  Schloss Dagstuhl - Leibniz Center for Informatics