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"Oscillation-Based Prebond TSV Test."

Li-Ren Huang et al. (2013)

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DOI: 10.1109/TCAD.2013.2259626

access: closed

type: Journal Article

metadata version: 2020-09-24

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  - https://dblp.org/rec/journals/tcad/HuangHSTC13
Li-Ren Huang, Shi-Yu Huang, Stephen K. Sunter, Kun-Han Tsai, Wu-Tung Cheng:
Oscillation-Based Prebond TSV Test. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(9): 1440-1444 (2013)

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