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"Grouping-Based TSV Test Architecture for Resistive Open and Bridge Defects ..."

Young-Woo Lee, Hyeonchan Lim, Sungho Kang (2017)

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DOI: 10.1109/TCAD.2016.2611505

access: closed

type: Journal Article

metadata version: 2024-02-27

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Young-Woo Lee, Hyeonchan Lim, Sungho Kang:
Grouping-Based TSV Test Architecture for Resistive Open and Bridge Defects in 3-D-ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(10): 1759-1763 (2017)

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