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"A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC."
Tianming Ni et al. (2021)
- Tianming Ni, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan, Xiaoqing Wen:
A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(9): 1952-1956 (2021)
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