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"Modeling and Application of Multi-Port TSV Networks in 3-D IC."

Wei Yao et al. (2013)

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DOI: 10.1109/TCAD.2012.2228740

access: closed

type: Journal Article

metadata version: 2021-05-28

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  - https://dblp.org/rec/journals/tcad/YaoPAFH13
Wei Yao, Siming Pan, Brice Achkir, Jun Fan, Lei He:
Modeling and Application of Multi-Port TSV Networks in 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 32(4): 487-496 (2013)

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