"Prebond Test of TSV Based on Voltage Skew Amplification."

Xianrui Dou et al. (2025)

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DOI: 10.1109/TCSII.2025.3615635

access: closed

type: Journal Article

metadata version: 2025-12-07

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Xianrui Dou, Huaguo Liang, Zhengfeng Huang, Yingchun Lu, Yue Wang, Tian Chen, Jun Liu:
Prebond Test of TSV Based on Voltage Skew Amplification. IEEE Trans. Circuits Syst. II Express Briefs 72(11): 1770-1774 (2025)

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