"An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method ..."

Cai Chen et al. (2017)

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DOI: 10.1109/TIE.2017.2723873

access: closed

type: Journal Article

metadata version: 2020-05-22

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Cai Chen, Yu Chen, Yuxiong Li, Zhizhao Huang, Teng Liu, Yong Kang:
An SiC-Based Half-Bridge Module With an Improved Hybrid Packaging Method for High Power Density Applications. IEEE Trans. Ind. Electron. 64(11): 8980-8991 (2017)

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