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"Packaging and integration technologies for future high-frequency power ..."

Seán Cian O'Mathuna et al. (2004)

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DOI: 10.1109/TIE.2004.837904

access: closed

type: Journal Article

metadata version: 2021-10-14

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Seán Cian O'Mathuna, Patrick Byrne, Gerald Duffy, Weimin Chen, Matthias Ludwig, Terence O'Donnell, Paul McCloskey, Maeve Duffy:
Packaging and integration technologies for future high-frequency power supplies. IEEE Trans. Ind. Electron. 51(6): 1305-1312 (2004)

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