Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging ..."

Lanyu Zhang et al. (2021)

> Home

Details and statistics

DOI: 10.1109/TIE.2020.3020018

access: closed

type: Journal Article

metadata version: 2023-09-30

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tie/ZhangGHCCTY21
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tie/ZhangGHCCTY21
Lanyu Zhang, Jian Gao, Yunbo He, Xin Chen, Yun Chen, Hui Tang, Zhijun Yang:
A VCM Active Actuation Method for Bonding Time Reduction in Chip Packaging Process. IEEE Trans. Ind. Electron. 68(8): 7252-7262 (2021)

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.