"Guest Editorial: Special Section on Developing Resilient Supply Chains in ..."

Ripon K. Chakrabortty, Mohammad Humyun Fuad Rahman, Weiping Ding (2023)

> Home

Details and statistics

DOI: 10.1109/TII.2023.3246645

access: closed

type: Journal Article

metadata version: 2025-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/tii/ChakraborttyRD23
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/tii/ChakraborttyRD23
Ripon K. Chakrabortty, Mohammad Humyun Fuad Rahman, Weiping Ding:
Guest Editorial: Special Section on Developing Resilient Supply Chains in a Post-COVID Pandemic Era: Application of Artificial Intelligent Technologies for Emerging Industry 5.0. IEEE Trans. Ind. Informatics 19(3): 3296-3299 (2023)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.